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Exopack To Debut Greener, MoreProtective Phototool Film Packaging At IPC APEX EXPO™ 2010
Exopack Advanced Coatings (EAC) is using the upcoming IPC APEX EXPO™ 2010 Conference to showcase new, more environmentally friendly packaging for its complete selection of high-performance phototool films. EAC reps will be available at Booth No. 337 to discuss the innovative packaging and answer questions from interested attendees.
Made from rugged brown corrugated board, the streamlined box offers customers significant cost, handling, shipping and storage advantages over conventional film enclosures. The company is already using the new package for deliveries of its Tecnilith® Amber Film - an extremely stable and easy-developing diazo-based product that hit the PCB commercial market last fall.
The new packaging eliminates use of Styrofoam and cardboard spacers common in previous three-piece configurations. Now films ship in a single, structurally stronger and cleaner package with less waste and no risk of shedding. Within the box, films are enclosed in a protective, vacuum sealed foil bag that opens easily and is fully reclosable. Films are supplied with three rounded corners and a familiar square notch - an indicator of the emulsion side.
That enhancement, the company anticipates, will significantly reduce any possibility of the packaged film puncturing the foil bag and simplify applications of the films within customer processes. Exopack Advanced Coatings has replaced conventional fiberboard package stiffeners with black plastic ones that are fully clean-room compatible.
Jeff Jarvis, Global Business Manager at Exopack Advanced Coatings, said the more space efficient packaging design will permit up to 30 percent more stacking capacity per pallet. "That translates to enhanced storage, less warehouse space, easier handling and inventorying and reduced costs for shipping," Jarvis said.
For more information about Exopack Advanced Coatings, its products and availability of technical support, visit www.exopackadvancedcoatings.com.
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